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Title :多結晶銅薄帯の疲労特性と転位組織
Title alternative :Fatigue Properties and Dislocation Structures of Polycrystalline Copper Film
Authors :兼城, 英夫
日賀, 正貴
真壁, 朝敏
片桐, 一宗
糸数, 真哉
Authors alternative :Kaneshiro, Hideo
Higa, Masaki
Makabe, Chobin
Katagiri, Kazumune
Itokazu, Masaya
Issue Date :25-Jun-1994
Abstract :Fatigue properties of polycrystalline copper films subjected to pulsating stresses are investigated on the basis of observations of surface topography, fracture surface and dislocation structure. Fatigue limit corresponding to 10^7 cycles of a rolled copper film is 2. 3 times higher than that of an annealed one, but the fatigue limit ratio of the rolled specimen is lower than that of annealed one. From the observations of the surface crack and fracture surface, it is found that fatigue crack initiation and early-stage crack growth mechanisms of annealed bulk copper are not necessarily applicable to those of film. No striations are formed in both films. In annealed films, cell structures are formed under high-cycle fatigue whereas no band/ladder structures are formed. Dislocation structures near the fatigue crack in annealed films are similar to those of bulk specimens except for the absence of intensely elongated cells observed in the shear flow regions in the bulk specimen. No appreciable change during fatigue was found in the dislocation structures of rolled films.
Type Local :雑誌掲載論文
ISSN :03875008
Publisher :日本機械学会
URI :http://hdl.handle.net/20.500.12000/220
Citation :日本機械学会論文集. A編 = Transactions of the Japan Society of Mechanical Engineers. A Vol.60 no.574 p.11 -18
Appears in Collections:Peer-reviewed Journal Articles (Faculty of Engineering)

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